Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Presentation, 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Parma, Italy
Study on the preferential growth mechanism of IMC at the interface of 3D packaging micro-bump solder joints under physical loadings
Talk, 2023 Electronic Packaging Materials and Testing Technology Conference, Guiyang, China
Enable understanding the preferential growth of intermetallic in electronic interconnects
Talk, WSE2023, Harbin, China
Reported recent works about developing multiphase field model for describing the intermetallic growth of Sn/Cu solder interconnects under physical loadings. The difference in growth rate of intermetallics was found to be related to the physical properties of the grains.