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portfolio
Portfolio item number 1
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publications
Paper Title Number 1
Published in Journal 1, 2009
This paper is about the number 1. The number 2 is left for future work.
Recommended citation: Your Name, You. (2009). "Paper Title Number 1." Journal 1. 1(1). http://academicpages.github.io/files/paper1.pdf
Paper Title Number 2
Published in Journal 1, 2010
This paper is about the number 2. The number 3 is left for future work.
Recommended citation: Your Name, You. (2010). "Paper Title Number 2." Journal 1. 1(2). http://academicpages.github.io/files/paper2.pdf
Paper Title Number 3
Published in Journal 1, 2015
This paper is about the number 3. The number 4 is left for future work.
Recommended citation: Your Name, You. (2015). "Paper Title Number 3." Journal 1. 1(3). http://academicpages.github.io/files/paper3.pdf
talks
Enable understanding the preferential growth of intermetallic in electronic interconnects
Published:
Reported recent works about developing multiphase field model for describing the intermetallic growth of Sn/Cu solder interconnects under physical loadings. The difference in growth rate of intermetallics was found to be related to the physical properties of the grains.
Microstructure-based fatigue analysis of SiC power module with sintered silver die attach
Published:
teaching
Introduction to Electronic Packaging and Manufacturing
Undergraduate course, Hefei University of Technology, Fall Term, starting in, 2023
This course mainly introduces the principles and process technologies for microelectronics packaging and manufacturing, teach the basic concepts and some important theories involved in the manufacturing process of the microelectronics industry. This course aims to enable students to understand the theory of microelectronics packaging and manufacturing, and enhance students’ knowledge and innovation capabilities in the field of microelectronics manufacturing.
Additive Manufacturing Technology
Undergraduate course, Hefei University of Technology, Fall Term, starting in, 2023
Updating …