Journal papers

2024

  1. H. Jiang, S. Liang, Y. Xu, S. Ramachandran, (2024). Investigation of Effects of Porosity and Coarsening on Thermal and Mechanical Properties of Sintered Silver Die Attachment. IEEE Transactions on Electron Devices, 71(9), 5603 - 5608. <link>
  1. S. Liang, H. Jiang, Z. Zhong, S. Ramachandran, (2024). Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling. IEEE Transactions on Electron Devices, 71, 192-199. <link>
  1. S. Liang, H. Jiang, J. Huang, (2024). Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing. Journal of Electronic Materials, 53, 1192-1200. <link>
  1. S. Liang, H. Jiang, Z. Zhong, Y. Xu, K. Song, (2024). Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging. Journal of Materials Research and Technology, 28, 4152-4161. <link>

2023

  1. S. Liang, C. Liu, H. Jiang, Z. Zhong, (2023). Investigation of Electric-thermal-mechanical Effects in Electric Assisted Silver Sintering Process through Phase Field Modelling. IEEE Transactions on Components, Packaging and Manufacturing Technology, 13, 1764-1769. <link>
  1. L. Zhang, H. Zhao, S. Liang, C. Liu, (2023). Heat transfer in phase change materials for integrated batteries and power electronics systems. Applied Thermal Engineering, 120997. <link>
  1. S. Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, H. Ma, C. Ke, (2023). Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing. Surfaces and Interfaces, 37, 102728. <link>
  1. S. Liang, X.P. Zhang, (2023). Unraveling the electric field effect on the grain‐boundary migration in alumina through phase field modeling. Journal of the American Ceramic Society, 106(3), 1647-1652. <link>

2022

  1. S. Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, C. Ke, Physically Informed Data-Driven Approach to Unravel the Orientation In fluenced Growth Behaviour of Interfacial Cu6sn5 Intermetallics Under Electric Current Stressing. SSRN Electronic Journal. <link>
  1. H. Jiang, S. Liang, C. Wei, C. Ke, (2022). Phase field modelling of the electromigration behaviour in sintered silver. Journal of Materials Research, 2322-2334. <link>
  1. H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu. Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array. Materials Letters, 131074. <link>
  1. H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu. Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer. Microelectronics Reliability, 114681. <link>
  1. H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu, (2022). Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite. Materials Today Communications, 104623. <link>
  1. S. Liang, A. Kunwar, C. Liu, H. Jiang, Z. Zhou, (2022). Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation. Journal of Materials Research and Technology, 345-353. <link>
  1. S. Liang, C. Liu, Z. Zhou, (2022). Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field. Materials Today Communications, 103408. <link>
  1. S. Liang, C. Wei, C. Ke, S. Cao, M. Zhou, X.P. Zhang, (2022). Investigation of the interaction effect between the microstructure evolution and the thermo-mechanical behavior of Cu-filled through silicon via. IEEE Transactions on Device and Materials Reliability, 267-275. <link>
  1. S. Liang, Y. Zhong, S. Roberston, A. Liu, H. Jiang, C. Liu, Z. Zhou, C. Liu, (2022). Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding. Microelectronics Reliability, 114654. <link>
  1. S. Liang, M. Zhou, C. Ke, C. Wei, X.P. Zhang, (2022). Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation. Microelectronics Reliability, 114611. <link>
  1. C. Liu, A. Liu, H. Jiang, S. Liang, Z. Zhou, C. Liu, (2022). Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging. Microelectronics Reliability, 114688. <link>
  1. S. Ramachandran, Y. Zhong, S. Robertson, C. Panteli, S. Liang, F. Wu, R. Zhou, S. Marathe, Z. Zhou, A. Holmes, S. Haigh, C. Liu, W. Mirihanage, (2022). Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding. Materialia, 101444. <link>
  1. F. Vogel, J. Cheng, S. Liang, C. Ke, S. Cao, X.P. Zhang, I. Zizak, A. Manzoni, J. Yu, A. Wanderka, W. Li, (2022). Formation and evolution of hierarchical microstructures in a Ni-based superalloy investigated by in situ high-temperature synchrotron X-ray diffraction. Journal of Alloys and Compounds, 165845. <link>

2021

  1. S. Liang, A. Kunwar, C. Wei, C. Ke, (2021). Insight into the preferential grain growth of intermetallics under electric current stressing-A phase field modeling. Scripta Materialia, 114071. <link>
  1. S. Liang, C. Wei, C. Ke, (2021). Effect of anisotropy in thermal conductivity on grain boundary migration under temperature gradient-A phase field study. Materials Letters, 130517. <link>
  1. S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, (2021). Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2122-2129. <link>

2020

  1. C. Wei, C. Ke, S. Liang, S. Cao, H. Ma, X.P. Zhang, (2020). An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy. Computational Materials Science, 109292. <link>

2019

  1. S. Liang, C. Ke, J. Huang, M. Zhou, X.P. Zhang, (2019) Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient. Microelectronics Reliability, 1-11. <link>
  1. S. Liang, C. Ke, C. Wei, M. Zhou, X.P. Zhang, (2019). Study of the influence of elastic anisotropy of Cu on thermo-mechanical behavior and Cu protrusion of through silicon vias using combined phase field and finite element methods. IEEE Transactions on Device and Materials Reliability, 322-332. <link>
  1. S. Liang, C. Ke, C. Wei, J. Huang, M. Zhou, X.P. Zhang, (2019). Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress. Journal of Materials Research, 2775-2788. <link>

2018

  1. J. Huang, M. Zhou, S. Liang, X.P. Zhang, (2018). Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3. 0Ag0. 5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature. Journal of Materials Science: Materials in Electronics, 7651-7660. <link>
  1. S. Liang, C. Ke, C. Wei, M. Zhou, X.P. Zhang, (2018). Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing. Journal of Applied Physics, 124. <link>

2017

  1. W. Ma, C. Ke, S. Liang, M. Zhou, X.P. Zhang, (2017). Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process-Phase field crystal simulation study. Transactions of Nonferrous Metals Society of China, 599-607. <link>
  1. S. Liang, C. Ke, W. Ma, X.P. Zhang, (2017). Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. Microelectronics Reliability, 71-81. <link>

2015

  1. W. Ma, C. Ke, M. Zhou, S. Liang, X.P. Zhang, (2015). Phase-field crystal simulation on evolu-tion and growth kinetics of kirkendall voids in interface and intermetallic compound layer in Sn/Cu soldering system. Acta Metallurgica Sinica, 873-882. <link>

Conference papers and presentations

2024

  1. Z. Guo, S. Liang, H. Jiang, Z. Zhong, K. Song, Y. Xu, (2024). Effect of Sintered Silver Phase Coarsening on the Fatigue Characteristics of SiC Power Modules. IEEE 25th International Conference on Electronic Packaging Technology (ICEPT). <link>
  1. S. Liang, W. Li, H. Jiang, Z. Guo, Z. Zhong, (2024). Effect of Phase Evolution on Inhomogeneous Deformation and Fracture Behavior in Sn-Bi Solder Alloys. IEEE 2024 International Conference on Electronics Packaging (ICEP), 161-162. <link>
  1. H. Jiang, S. Liang, C. Liu, (2024). Simulation Study of Pore Structure Evolution and its Influences on the Properties of Sintered Silver. IEEE 2024 International Conference on Electronics Packaging (ICEP), 159-160. <link>

2022

  1. H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu, (2022). Microstructural and mechanical integrity of Cu/Cu joints formed through transient liquid bonding with Cu-Sn nanocomposite interlayer. IEEE 24th Electronics Packaging Technology Conference (EPTC), 964-968. <link>
  1. C. Liu, H. Jiang, S. Liang, A. Liu, Z. Zhou, C. Liu, (2022). Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging. IEEE 24th Electronics Packaging Technology Conference (EPTC), 439-442. <link>

2021

  1. Y. Chen, S .Liang, C. Liu, C. Liu, Z. Zhou, (2021). Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding. IEEE 23rd Electronics Packaging Technology Conference (EPTC), 451-459. <link>
  1. B. Yang, J. Fei, S. Liang, M. Zhou, W. Hu, H. Huang, X.P. Zhang, (2021). 3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints. IEEE 71st Electronic Components and Technology Conference (ECTC), 1405-1411. <link>

2020

  1. S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, (2020). Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding. IEEE 70th Electronic Components and Technology Conference (ECTC), 269-275. <link>
  1. L. Zhang, S. Liang, Z. Zhou, X. Han, C. Liu, (2020). A numerical study of heat transfer in PCM composites for the integration of batteries and power electronics. IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6. <link>
  1. Y. Zhong, A. Liu, S. Robertson, S. Liang, S. Liu, Z. Zhou, C. Liu, (2020). Quasi-ambient bonding semiconductor components for power electronics integration. IIEEE 70th Electronic Components and Technology Conference (ECTC), 1468-1473. <link>

2019

  1. J. Zhou, S. Liang, C. Wei, W. Le, C. Ke, M. Zhou, X. Ma, X.P. Zhang, (2019). Three-dimensional simulation of the thermo-mechanical interaction between the micro-bump joints and Cu protrusion in Cu-filled TSVs of the high bandwidth memory (HBM) structure. IEEE 69th Electronic Components and Technology Conference (ECTC), 410-416. <link>

2018

  1. S. Liang, C. Ke, C.Wei, M. Zhou, X.P. Zhang, (2018). Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient. 19th International Conference on Electronic Packaging Technology (ICEPT), 376-382. <link>
  1. S. Liang, C. Ke, C. Wei, M. Zhou, X.P. Zhang, (2018). Three-dimensional simulation of effects of microstructure evolution and interfacial delamination on Cu protrusion in copper filled through silicon vias by combined Monte Carlo and finite element methods. IEEE 68th Electronic Components and Technology Conference (ECTC), 2134-2141. <link>
  1. S. Liang, X.P. Zhang, C. Wei, C. Ke, C. Liu, (2018). Interaction effects between the preferred growth of ?-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling. 7th Electronic System-Integration Technology Conference (ESTC), 1-7. <link>
  1. J. Zhou, C. Wei, S. Liang, H. Jiang, X. Ma, X.P. Zhang, (2018). Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration. 19th International Conference on Electronic Packaging Technology (ICEPT), 361-366. <link>

2017

  1. S. Liang, C. Ke, B. Li, H. Jiang, M. Zhou, X.P. Zhang, (2017). Microstructure simulation and thermo-mechanical behavior analysis of copper filled through silicon vias using coupled phase field and finite element methods. IEEE 67th Electronic Components and Technology Conference (ECTC), 1668-1674. <link>
  1. S. Liang, C. Ke, M. Zhou, X.P. Zhang, (2017). Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field. 18th International Conference on Electronic Packaging Technology (ICEPT), 1631-1636. <link>
  1. S. Liang, C. Wei, C. Ke, M. Zhou, X.P. Zhang, (2017). Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method. 18th International Conference on Electronic Packaging Technology (ICEPT), 1617-1622. <link>

2016

  1. H. Jiang, S. Liang, H. Yuwen, X.P. Zhang, (2016). Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure. 17th International Conference on Electronic Packaging Technology (ICEPT), 947-952. <link>
  1. S. Liang, C. Ke, W. Ma, M. Zhou, X.P. Zhang, (2016). Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing. IEEE 66th Electronic Components and Technology Conference (ECTC), 264-270. <link>
  1. S. Liang, C. Ke, M. Tan, M. Zhou, X.P. Zhang, (2016). Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects. 17th International Conference on Electronic Packaging Technology (ICEPT), 836-840. <link>
  1. S. Liang, C. Ke, M. Zhou, X.P. Zhang, (2016). Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient. 17th International Conference on Electronic Packaging Technology (ICEPT), 953-957. <link>

2015

  1. S. Liang, C. Ke, M. Zhou, X.P. Zhang, (2015). Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation. 16th International Conference on Electronic Packaging Technology (ICEPT), 260-265. <link>
  1. W. Ma, C. Ke, S. Liang, M. Zhou, X.P. Zhang, (2015). Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading. 16th International Conference on Electronic Packaging Technology (ICEPT), 301-306. <link>

2014

  1. S. Liang, C. Ke, W. Ma, M. Zhou, X.P. Zhang, (2014). Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects. 15th International Conference on Electronic Packaging Technology, 641-645. <link>

PhD thesis

S. Liang, (2019). Phase Field Study of the Microstructure Evolution and Its Influence on Reliability of Microscale Interconnects under Electro-thermo-mechanical Loads. PhD thesis, South China University of Technology.