Portfolio item number 1
Short description of portfolio item number 1
Short description of portfolio item number 1
Short description of portfolio item number 2
Published in Journal 1, 2009
This paper is about the number 1. The number 2 is left for future work.
Recommended citation: Your Name, You. (2009). "Paper Title Number 1." Journal 1. 1(1). http://academicpages.github.io/files/paper1.pdf
Published in Journal 1, 2010
This paper is about the number 2. The number 3 is left for future work.
Recommended citation: Your Name, You. (2010). "Paper Title Number 2." Journal 1. 1(2). http://academicpages.github.io/files/paper2.pdf
Published in Journal 1, 2015
This paper is about the number 3. The number 4 is left for future work.
Recommended citation: Your Name, You. (2015). "Paper Title Number 3." Journal 1. 1(3). http://academicpages.github.io/files/paper3.pdf
Published:
Reported recent works about developing multiphase field model for describing the intermetallic growth of Sn/Cu solder interconnects under physical loadings. The difference in growth rate of intermetallics was found to be related to the physical properties of the grains.
Published:
Undergraduate course, Hefei University of Technology, Fall Term, starting in, 2023
This course mainly introduces the principles and process technologies for microelectronics packaging and manufacturing, teach the basic concepts and some important theories involved in the manufacturing process of the microelectronics industry. This course aims to enable students to understand the theory of microelectronics packaging and manufacturing, and enhance students’ knowledge and innovation capabilities in the field of microelectronics manufacturing.
Undergraduate course, Hefei University of Technology, Fall Term, starting in, 2023
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